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Comparison: Performance Differences Between FR4 Epoxy Fiberglass Board and Other Materials


In the electronics industry, the selection of circuit board substrate materials is critical to product performance and reliability. FR4 epoxy fiberglass board, as one of the common substrate materials, has its unique advantages. However, there are a variety of other materials available on the market, each with its own characteristics and properties. This article will compare the performance differences between FR4 epoxy fiberglass board and several other common materials to help readers better understand the advantages and disadvantages of various materials and provide a reference for selecting appropriate substrate materials.

1. Characteristics of FR4 epoxy fiberglass board

FR4 epoxy fiberglass board is composed of epoxy resin and fiberglass cloth and has excellent insulation properties, mechanical strength, heat resistance and moisture resistance. In addition, FR4 boards also have good processing performance and dimensional stability, which facilitates the design and manufacturing of circuit boards. These characteristics make FR4 epoxy fiberglass boards widely used in the electronics industry.

2. Comparison of performance differences with other materials

Comparison with metal substrate materials
Metal substrate materials, such as copper, aluminum, etc., have good electrical conductivity and heat dissipation properties. However, the insulation performance of metal substrate materials is poor, and additional insulation treatment is required to ensure the safety of the circuit. In addition, metal substrate materials are difficult to process and the cost is relatively high. In comparison, FR4 epoxy fiberglass board has better insulation performance and processing performance, and the cost is relatively low.

Comparison with paper substrate materials
Paper substrate materials, such as phenolic paper substrate, polyimide paper substrate, etc., have lower cost and lighter weight. However, they have poor mechanical strength and heat resistance and are susceptible to deformation due to environmental humidity. In comparison, FR4 epoxy fiberglass board has higher mechanical strength and heat resistance, and better dimensional stability.

Comparison with ceramic substrate materials
Ceramic substrate materials have high insulation, high thermal stability and good chemical stability. However, ceramic substrate materials are costly, difficult to process, and fragile. These shortcomings limit the application of ceramic substrate materials in certain fields. In contrast, although the insulation performance of FR4 epoxy fiberglass board is slightly inferior to that of ceramic substrate materials, its cost is lower, its processing performance is good, and it is more suitable for mass production.

Comparison with polymer substrate materials
Polymer substrate materials, such as polyimide (PI), polytetrafluoroethylene (PTFE), etc., have good insulation properties, heat resistance and chemical stability. However, polymer substrate materials have low mechanical strength and are prone to deformation during processing. In addition, the cost of polymer substrate materials is relatively high. In comparison, FR4 epoxy fiberglass board has certain advantages in terms of mechanical strength, heat resistance and cost.

3. Summary

Through comparison, it can be seen that FR4 epoxy fiberglass board has certain advantages in terms of insulation performance, mechanical strength, heat resistance, moisture resistance, processing performance and cost. Of course, various materials have their applicable scenarios and limitations. When selecting a substrate material, you need to comprehensively consider factors such as specific application requirements, working environment, and cost budget. We hope that the comparative analysis in this article can provide readers with some reference and help when choosing circuit board substrate materials.

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